Examining 3D Integrated Circuits for Dependable Stress Assessment at the Die Level
In the rapidly evolving world of semiconductor innovation, the importance of ensuring reliability and performance in next-generation integrated circuits, particularly those that use heterogeneous and multi-die architectures, cannot be overstated. This is where Siemens EDA's Calibre 3DStress comes into play, offering a comprehensive solution to the challenges posed by 3D IC stress analysis.
Shetha Nolke, a Principal Product Manager at Siemens EDA with 23 years of experience in semiconductor innovation, has spent the last ten years driving technical breakthroughs in the Calibre division. Her work, along with the Calibre 3DStress team, is focused on addressing the complexity and risk in 3D IC design.
The benefits of 3D IC stress analysis are significant. Improved reliability is achieved by identifying potential mechanical and thermal stress points that could lead to failure or reduced lifespan of the chip. Enhanced yield is another advantage, with early detection of stress-related issues allowing for design corrections before fabrication, reducing costly defects and improving manufacturing yield. Accurate simulation at the transistor level provides granular insights, enabling accurate prediction of how mechanical stress impacts device performance and electrical behavior. Furthermore, multiphysics integration leads to more holistic design verification and optimization.
However, the challenges of 3D IC stress analysis are equally formidable. Design complexity, multiphysics simulation needs, scale and computational demand, and data management are all areas that Calibre 3DStress addresses effectively.
Calibre 3DStress provides accurate, transistor-level analysis of thermo-mechanical stresses, offering designers granular insights for more precise reliability improvements. It enables early analysis and simulation of chip/package interactions throughout the design process, helping to identify and mitigate stress-related risks before fabrication. The software works in conjunction with Siemens’ Innovator3D IC suite, creating an end-to-end environment that supports multiphysics simulations, including electrical, thermal, and mechanical analysis.
By streamlining design and analysis workflows, Calibre 3DStress helps semiconductor companies reduce risk, accelerate productivity, and meet strict design timelines by efficiently addressing the complexities of 3D ICs. The combined Innovator3D IC suite and Calibre 3DStress offer features for design authoring, system-level simulation, constrained routing, and chip-to-chip interface verification, supporting reliable and efficient 3D IC development.
In summary, Calibre 3DStress from Siemens EDA addresses the complexity and risk in 3D IC design by delivering advanced, multiphysics-aware analysis at the transistor level, enabling earlier and more accurate identification of reliability issues, and providing the tools needed to optimize both design and manufacturing outcomes. The software reduces the risk of field failures, warranty claims, and costly respins, and has the capacity to bridge mechanical analysis and electrical sign-off by back-annotating physical stress data into netlists and device models.
For organizations that want a leadership position in 3D IC design and advanced packaging, Calibre 3DStress is crucial. It helps accelerate time-to-market by shortening debug and sign-off cycles, and a chip-level 3D stress analysis software would model all elements of the packaged stack, from millimeter-scale substrates down to nanometer device regions. With Shetha Nolke at the helm, Siemens EDA continues to push the boundaries of semiconductor innovation, ensuring that the next generation of reliable, manufacturable, and innovative semiconductor products are within reach.
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